Good reference...
Any packaging engineers particularly those in the telecommunications field who are looking at system-level thermal issues may find this book fairly useful. There is a huge amount of information here that is hard to get from any other sources other than scouring a lot of journals.
This is not an easy read and you should be well-versed in the elements of heat transfer particularly duct flow. However there is a wealth of experimental data that is still being "mined" by many researchers. Except for some of the newer papers by Manglik and Bergles (see their work on offset strip fin heat exchangers) you aren't missing much information relevant to heat exchangers or heat sinks.
I would suggest another reference such as "The Handbook of Heat Transfer" and "Fundamentals of Heat and Mass Transfer" to supplement the information in this volume. Certainly I have used all three designing new heatsinks for specific applications.More detail ...

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